Your computer will gulp water

New Technology
Written by Team Josh
Friday, 06 June 2008
As the computer technology advancing, it is facing a vexing problem. The problem is Heat! As chips get smaller and smaller, cramming more processing power into ever-tinier spaces, the heat thrown off by the miniature circuits becomes harder to manage. Cooling measures used now to avoid chip meltdowns, including “heat sinks” made from heat-absorbing materials, might not work on tinier scales. Moreover, reports suggest that IBM is exploring – in which chips are stacked vertically to save space and enhance performance, rather than arrayed next to each other. These will exceed the heat ratio. To overcome this problem IBM researchers say they could pipe water in between chips that are sandwiched together. The system will use pipes that are just 50 microns wide – 50 millionths of a meter. The tiny tubes will, of course, be sealed to prevent leaks and electrical shorts. So get ready to see your computer gulping water. Set as favorite Bookmark Email This Hits: 194 Trackback(0) TrackBack URI for this entry Comments (0) Subscribe to this comment's feed Write comment Name Website Comment smaller \| bigger Subscribe via email (Registered users only) I have read and agree to the Terms of Usage. Write the displayed characters
Last Updated ( Friday, 06 June 2008 )